Today's Hard|Forum Post
Today's Hard|Forum Post

Tuesday February 07, 2017

Western Digital Begins Production of World's Tallest 3D NAND "Skyscraper"

Western Digital is gearing up the release of the first-ever 512-gigabit, 64-layer 3D NAND chip. Working in partnership with Toshiba, WD has managed to double the density of the chips they originally announced this past summer. Competitor Micron is also hard at work on their own 64-layer 3D NAND chips, but so far, they are only half as impressive at 256Gb. It is hard to say when we will start seeing these in devices, but mass production is definitely happening this year.

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Western Digitalآ…has kicked off production of the industry's densest 3D NAND flash chips, which stack 64 layers atop another and enable three bits of data to be stored in each cell. The 3D NAND flash chips are based on a vertical stacking or 3D technology that Western Digital and partner Toshiba call BiCS (Bit Cost Scaling). WD has launched its pilot production of its first 512 gigabit (Gb) 3D NAND chip based on the 64-layer NAND flash technology. In the same way a skyscraper allows for greater density in a smaller footprint, stacking NAND flash cells -- versus planar or 2D memory -enables manufacturers to increase density, which enables lower cost per gigabyte of capacity. The technology also increases data reliability and improves the speed of solid-state memory.

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