Friday October 16, 2015

AMD and NFME To Establish Industry-Leading Semiconductor Assembly and Test Joint Venture

​AMD and Nantong Fujitsu Microelectronics Co., Ltd today announced the signing of a definitive agreement to create a joint venture combining AMD’s high-volume assembly, test, mark, and pack (ATMP) facilities and experienced workforce in Penang, Malaysia and Suzhou, China with NFME’s established outsourced semiconductor assembly and test (OSAT) expertise. Upon close, the new business will leverage the capabilities of 5 facilities and approximately 5,800 employees to offer differentiated ATMP capabilities and scale to service a broad range of customers. The transaction is expected to close in the first half of 2016, pending successful completion of regulatory approvals.

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