Monday August 06, 2012

TSMC and ASML Agree to Develop Next Generation Lithography Technologies

TSMC today announced it has joined ASML Holding N.V. Customer Co-Investment Program, aimed at accelerating the development and industrialization of key next-generation semiconductor manufacturing technologies, which include extreme ultraviolet (EUV) lithography technology and 450-millimeter lithography tools. The agreement includes an investment amount of 838 million euros in ASML to acquire a 5% of its equity; and to commit 276 million euros, spread over 5 years, to ASML’s research and development programs.