Intel Completes Next Generation, 32nm Process Development Phase

Intel Corporation has completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 nanometers (a billionth of a meter). The company is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009. Intel will provide a multitude of technical details around the 32nm process technology along with several other topics during presentations at the International Electron Devices meeting (IEDM) next week in San Francisco.