SilverStone Heligon HE01 CPU Cooler Review
SilverStone brings us a newly design CPU cooler with wider fin spacing and an internally mounted adjustable 140mm adjustable speed fan sporting six heatpipes and Nickel-coated copper base. The Heligon HE01 is supplied with hardware that supports all recent socket configurations from both Intel and AMD.
When it comes to certain products, there are company names that you expect to hear mentioned. In SilverStone’s case, it would be nearly impossible to talk about power supplies or chassis without its name being brought up. Just the other month we looked at SilverStone’s radically designed case dubbed the Raven 2. Speaking of its power supplies, we have looked at many of those over the last five years.
It may seem a bit out of place when we bring up the name SilverStone in the same breath as heatsinks but don’t let that fool you. SilverStone is committed to using its engineering know-how to bring to market some of the most competitive coolers. To this end, we present our review of the SilverStone Heligon HE01. Awkward naming convention aside, the HE01 ticks a lot of check boxes; large 140mm fan, dual tower design, six heat pipes, Nickel-coated copper base, check. It would seem SilverStone is aiming for a homerun with this cooler. All that is left for us to do is break down its performance and weigh its value. Let’s get started.
Today's review utilizes our third generation [H]ard platform. The test bed consists of the ASUS P8Z77-V motherboard, 8GB Corsair 1600 MHz DDR3 RAM, and a retail Intel Core i7 3770K.
The biggest change you will notice is the removal of hardware testing. In recent years, Intel has shifted its methods of testing to software based and so we find it acceptable to do the same.
For the first time, we have an integrated GPU in our processor which alleviates the need for a discrete one. With the removal of a discrete GPU comes the advantage of not having an additional variable to account for.
The iGPU will not create any anomalies in our testing as long as we practice consistent testing methods.
Corsair was kind enough to provide us with its Carbide series chassis. It provides excellent airflow and interior space and is a good reflection on current case design.
Noctua's NT-H1 thermal paste was selected as the paste of choice for a few key reasons. The thermal paste has been shown to provide excellent thermal conductivity allowing the heat sinks to better do its job. There is no observed curing time. That is, performance does not get any better over time. Any curing time could have introduced variables into the equation causing at best dubious results and at worst unreliable ones.
Ambient temperature will be kept at 25C for the duration of the tests and measured with a MicroTemp EXP non-contact infrared thermometer and cross referenced with the Sperry Digital 4 Point thermometer. Any variance greater then 0.2C will halt the testing until temperatures return within spec for fifteen minutes.
If we are dealing with water cooling we will allow extra time for each test to give the water in the loop enough time to reach equilibrium.
Idle temperatures will be recorded after a twenty-five minute period of inactivity. Any fluctuation during the last sixty seconds will reset the timer for an additional five minutes.
Load temperatures will be recorded after a twenty-five minute period of 100% load. To obtain this load we will be using Prime95 v27.7 set to in-place large FFTs mode. In this way we can place a 100% load on CPU. Any fluctuation during the last sixty seconds will reset the timer for an additional five minutes.
Sound levels will be measured with a Reliability Direct AR824 sound meter from a distance of four feet. With everything turned off and the room completely silent the meter registered a sound level of 38dB(A). This is a very quiet room where a simple pin drop could be heard. All sound measurements are recorded in the very late evening to further reduce any ambient noise.