![[H]ardOCP](/images/blank.gif){kind=small}
- Date:
- Thursday , January 27, 2005
- Author:
- Morry Teitelman
- Editor:
- Kyle Bennett
- Google +1
DFI 855GME-MGF
The 855GME-MGF is one of the first retail motherboards able to use the much-vaunted Pentium-M line of processors. Read on to find out if this board should be your next major upgrade.
Introduction
DFI has become a recent favorite among enthusiasts for their new focus on overclocking and performance. Traditionally, DFI has catered to the system builder and OEM manufacturers. Of late, they have strived to make inroads to the enthusiast community through their LANParty and Infinity series boards. Their latest board continues this trend.
The 855GME-MGF is DFI’s latest motherboard creation that is based around Intel’s mobile socket mPGA479M technology. DFI chose to use the Intel 855GME chipset, boasting full support for all Pentium M and Celeron M-based mobile processors, DDR RAM operating in Single Channel mode up to speeds of 333MHz officially, and onboard Intel graphics. The 855GME-MGF is feature complete, only requiring a socket mPGA479M based processor, DDR memory, and a PSU for a functional system. DFI integrated the following components into the 855GME-MGF’s design: 2 IDE ATA-100 ports; 2 SATA-150 ports (RAID 0 and 1 capable); 4 USB 2.0 capable ports in the rear panel; 2 IEEE 1394 capable ports (1 in rear panel, 1 onboard header supporting 1 port each); Realtek GigE controller; Realtek 6.1 channel audio codec; onboard Intel graphics; and PS/2 port support.
Main Specifications Overview:
CPU | Intel socket mPGA479M based processors |
Chipset | Intel 855GME / 6300ESB |
FSB | 400MHz |
BIOS | Phoenix AwardBIOS |
Memory | 2 184-pin DDR DIMMS, up to2 GB |
Expansion slots | 1 x AGP slot, 2 x PCI slots, 1 PCI-X slot |
Onboard IDE | 2 x IDE ATA-100 port; 2 x SATA 150 ports |
USB 2.0 | 4 ports in rear panel |
IEEE 1394 | 1 rear panel / 1 header supporting 1 port (2 ports total) |
Audio | 6-Channel Realtek codec |
NIC | Realtek GigE controller |
Detailed Mainboard Specification List:
|
|
Packaging
DFI went with a simple design on the box front, with the board features artistically rendered along the left side of the box, and the board name itself prominently displayed in the middle. The following components were included with the 855GME-MGF board: ATA 133 and floppy ribbon cables; SATA 150 cables; dual ended SATA power cables; CPU cooler; the rear shield; and the normal complement of driver CDs and manuals.
Board Layout
DFI took a minimalist approach in designing the 855GME, most likely due to the fact that the board is a microATX design and is based around a mobile chipset. However, there are no real tight areas on the board, with all components having sufficient space between one another. The board had no distinguishing markings on it to designate a board revision number or even a serial number. DFI chose to use capacitors from the following manufacturers in their design: Taiwan Ostor Corporation (Taiwan); and United Chemi-Con (USA, Japan) - marked as KZG, KME.
The CPU socket area is relatively clear of obstructions, and should provide no heatsink-related issues when using the DFI provided unit. However, if you want to use a larger heatsink, you may have issues with the capacitors to the left and right of the socket area. The heatsink itself mounts to the boards using a 4 hole mounting mechanism, with a rear board bracket fixing the heatsink to the top of the CPU. One unique thing with the socket design is the lack of CPU retention mechanism. Instead, the socket has an integrated screw at the bottom of the socket that locks in one position, and unlocks in the other. A small flathead screwdriver works best to lock or unlock the socket. The Northbridge chipset is passively cooled by a moderately sized aluminum heatsink. The heatsink attaches to the Northbridge using two wire loops on opposite sides of the chipset. Above the Northbridge chipset are the FSB Select and USB Power Select jumpers, as well as the onboard IEEE 1394 header. The FSB Select jumper determines the current FSB setting for the processor, with available settings of Auto, 100MHz, and 133MHz. The USB Power Select jumper controls system wakeup based on USB device activity from the rear panel USB 2.0 ports. Above the CPU socket are the infrared header and the PS/2 Power Select jumper. The PS/2 Power Select jumper controls system wakeup based on USB device activity from the rear panel PS/2 ports. The CPU fan header is located just below the CPU socket.
The 2 onboard DDR DIMM slots are located below the CPU socket and Northbridge chipset. Although it looks tight between the left of the memory slots and the AGP slot, I found no issues inserting or removing memory modules with an AGP card installed. Directly below the DIMM slots are the 2 IDE ports, the floppy port, the 20-pin ATX power connector, and the 2nd fan header.
The 6300ESB Southbridge chipset is located directly below the PCI-X slot, cooled by a small sized heatsink. The heatsink mounts to the board using 2 push pins on opposite sides of the chipset. The 2 SATA-150 ports are located to the lower right of the chipset, with the CMOS reset jumper directly below the chipset. The Chassis fan header and the front panel header are located in the lower left corner of the board. To the upper right of the chipset are an onboard speaker and the CMOS battery.
The 855GME has 1 AGP slot, 2 PCI slots, and 1 PCI-X slot. The COM 2 header, the S/PDIF output header, and the front panel audio header are located to the upper right of the second PCI slot, along the board’s edge. Note that the rear panel audio ports will not function unless pins 5/6 and 9/10 on the front panel audio header are jumpered. The CD_IN port is located in between the PCI-X slot and PCI slot 2.
The 8855GME-MGF’s rear panel contains the following devices: PS/2 keyboard and mouse ports; 1 parallel port; 1 serial port; 1 Intel graphics VGA port; 4 USB 2.0 ports; 1 IEEE 1394 port; 1 Realtek GigE LAN port; and 3 analogue audio ports.