- Date:
- Tuesday , January 20, 2004
- Author:
- Morry Teitelman
- Editor:
- Kyle Bennett
- Google +1

ST61G4 SFF PC
We review Shuttle’s latest Small Form Factor XPC using the new ATI 9100 IGP chipset. We compare and contrast it with the big guns.
Introduction
Shuttle traditionally catered to the OEM and system builder crowd with very stable and solid motherboard solutions. Then came the XPC, and suddenly Shuttle was in the mainstream enthusiast limelight. Coupling an innovative all in one SFF (small form factor) design with some of the most powerful chipsets on the planet, Shuttle quickly won over the hearts and minds of enthusiasts and LAN gamers everywhere.

The ST61G4 is the latest release for their XPC line of SFF (small form factor) PCs based on the ATI 9100 IGP chipset. The ATI 9100 IGP chipset offers full support for all Intel Pentium 4 socket 478 processors, including their performance line of 800 MHz FSB processors. As a direct competitor of the Intel based chipsets, the 9100 IGP also offers full support for PC3200 DDR memory running in Dual Channel mode. As a member of the XPC line, the ST61G4 is a complete barebones PC, requiring only CPU, DRAM, and drives for a fully functional system. The ST61G4 includes the following integrated components: 2 UDMA 100 IDE ports; 2 SATA-150 ports with built-in RAID0 and RAID1 support through the Silicon Image controller; integrated 10/100 Ethernet controller; 4 total USB 2.0 capable ports(2 in rear panel, and 2 in front panel); 2 IEEEE 1394 capable ports (1 in rear panel, and 1 mini port in front panel); 6 channel audio featuring S/PDIF input / output ports; onboard Radeon 9100 graphics processor with integrated TV decoder; and the standard serial, and PS/2 ports.
Main Specifications Overview:
CPU | Intel Pentium 4 based processors |
Chipset | ATI 9100 IGP - RS300 / IXP150 |
FSB | 400/533/800 MHz |
BIOS | Phoenix AwardBIOS |
Memory | 2 DDR DIMMS, up to 2 GB |
Expansion slots | 1 x AGP, 1 x PCI |
Onboard IDE | 2 x UDMA 100 ports; Silicon Image controller supporting 2 x SATA 150 RAID 0 and RAID 1 capable ports |
USB 2.0 | 2 rear panel / 2 front panel (4 ports total) |
IEEE 1394 | 1 rear panel / 1 front panel (2 ports total) |
AGP | AGP 4x/8x |
Audio | 6-Channel audio codec with S/PDIF input and output ports
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NIC | 1 x Broadcom 10/100 Ethernet controller in rear panel |
Integrated Video | Radeon 9100 graphics controller with integrated TV decoder |
Detailed Mainboard Specification List:
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Packaging/Case
The box features the standard XPC adornment, with the board's attributes graphically listed boldly across the box top. The box also doubles as a carrying case for the unit, with its built in handle. Shuttle included the following components with the unit: driver CD, installation and usage manuals, 2 ATA 100 IDE cables, 1 floppy cable, 1 SATA cable, feet for the front bottom of the case, adhesive strips and zip ties for cable routing, a lint free cloth for buffing the surface of the box to a mirror shine, and an S-Video to RCA converter cable.
The unit itself is entirely modular, with the ability to remove the upper drive bay, the PSU, the I.C.E. heat-pipe unit, as well as the motherboard itself. The hard drive cage itself takes up the upper front portion of the case, and has room for a hard drive and a CD-ROM drive. You may be able to fit 2 hard drives in to the drive cage, if one is creatively mounted behind the 6 in 1 card reader. It seems that the I.C.E. (Integrated Cooling Engine)system included with the ST61G4 is a bit of an updated design, in that CPU contact point is a copper heat spreader. The copper heat spreader allows for better heat transfer over a larger area, making a very good heat-pipe design even better.
While the inside of the system is rather tight for space, Shuttle employs extremely effective cable routing methods to support the plethora of ports available in the front and rear of the case. From the case front, you have access to 2 USB 2.0 ports, 1 IEEE 1394 min port, line-in, microphone, and headphone audio ports, as well as the standard power and reset buttons, with a blue LED for power and an orange LED for drive activity. The back end of the case offers contains the rear panel shield for the motherboard ports, with the exhaust for both the I.C.E. cooling system and the PSU unit just above it. Notice that the PCI and AGP cards have two hold down mechanisms – the standard screw as well as a locking mechanism that swings up and down for better card support Both the I.C.E. system fan as well as the system cover are held on with thumb screws, making for a nice look. The rear panel itself contains the following ports: PS/2 keyboard and mouse ports; Radeon 9100 VGA port; S-video TV-out port; 1 serial port; 1 IEEE 1394a port; 2 USB 2.0 ports; a 10/100 Ethernet port; and 3 audio ports for your front, rear, and center channel speakers. The S/PDIF optical input and output ports are located just above the PCI and AGP brackets.
Board Layout
The board follows the standard XPC design, with amazingly little in the way of contention given the sheer amount of integrated components. The biggest problem area is the AGP slot placement towards the outside of the board, which can limit the choice of AGP card to use. The board itself had no revision or serial number type marking of any kind. In designing the board, Shuttle chose to integrate capacitors manufactured by Luxon Electronics Corporation (Taiwan), and Taiwan Ostor Corporation (Taiwan).
With the exception of the row of capacitors to the right of the CPU socket, the area around the socket is clear of components. The capacitors do not inhibit mounting and removal of the I.C.E. unit though. If you choose to replace the I.C.E unit, you will be hard pressed for vertical space since the hard drive cage sits above the lower portion of the socket. Just above and to the left of the socket are the 2 SATA ports, with the BIOS monitored CPU and Northbridge fan headers directly above as well. Just above the fan headers are a wireless keyboard/mouse header, and the CD-IN connector. The on board parallel port header is located to the upper right of the CPU socket. The floppy port is located at the upper right side of the board, along the board’s edge, with the IrDA header just to its left.
The 2 DIMM slots are located along the lower edge of the board, with the actively cooled RS300 Northbridge just above them. The Northbridge HSF unit is held to the chipset by a wire clamp connected to 2 hoops on the motherboard. This mounting mechanism allows for easy removal of the unit, should you desire. Below the DIMM slots are the 2 UDMA 100 IDE ports, as well as the ATX power connector. The ATX 12V power connector is located just above the upper DIMM slot, along the right edge of the board. A BIOS monitored fan header is located to the right of the Northbridge as well. To the left of the DIMM slots, along the edge of the board, are the front panel header and a USB 2.0 header.
The ATI IXP150 Southbridge chipset is located between the Northbridge chipset and the left edge of the board. In a smart move, Shuttle placed the CMOS reset jumper along the outer left edge of the board, just below the Southbridge. With the case cover removed, this jumper is very easily accessible.
The ST61G4 has a total of 1 PCI slot and 1 AGP slot. The AGP slot is positioned along the outside edge of the board, though, making AGP card selection critical. The CMOS battery is just below the PCI slot, with the front panel port connector between the PCI slot and the CPU socket area. The AUX_IN connector is located above the AGP slot, along the board’s edge. The S/PDIF connector is just to the left of the rear panel ports, above the PCI slot.
